A novel method for fatigue testing of MEMS devices containing movable elements

In this paper we present an electronic circuit for position or capacitance estimation of MEMS electrostatic actuators based on a switched capacitor technique. The circuit uses a capacitive divider configuration composed by a fixed capacitor and the variable capacitance of the electrostatic actuator for generating a signal that is a function of the input voltage and capacitive ratio. The proposed circuit can be used to actuate and to sense position of an electrostatic MEMS actuator without extra sensing elements. This approach is compatible with the requirements of most analog feedback systems and the circuit topology of pulsed digital oscillators (PDO).Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Package Hermeticity Testing with Thermal Transient Measurements

The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Creating temperature dependent Ni-MH battery models for low power mobile devices

In this paper the methodology and the results of creating temperature dependent battery models for ambient intelligence applications is presented. First the measurement technology and the model generation process is presented in details, and then the characteristic features of the models are discussed.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology

Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as consequence of the differences in their manufacturing processes e.g. different etching times. We have made simulations examining how the etching quality reflects in the thermal behaviour of devices. These simulations predicted change in the thermal behaviour of MEMS structures having differences in their sacrificial layers. The theory was tested with measurements of similar MEMS devices prepared with different etching times. In the measurements we used the T3Ster thermal transient tester equipment. The results show that deviations in the devices, as consequence of the different etching times, result in different temperature elevations and manifest also as shift in time in the relevant temperature transient curves.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions